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NTP45N06L, NTB45N06L
PACKAGE DIMENSIONS
D 2 PAK
CASE 418B?04
ISSUE J
C
NOTES:
1. DIMENSIONING AND TOLERANCING
?B?
E
V
W
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B?01 THRU 418B?03 OBSOLETE,
NEW STANDARD 418B?04.
4
DIM
A
INCHES
MIN MAX
0.340 0.380
MILLIMETERS
MIN MAX
8.64 9.65
A
B
0.380 0.405
9.65 10.29
1
2
3
S
C
D
0.160 0.190
0.020 0.035
4.06 4.83
0.51 0.89
E
F
0.045 0.055
0.310 0.350
1.14 1.40
7.87 8.89
?T?
SEATING
PLANE
G
K
J
W
G
H
J
K
0.100 BSC
0.080 0.110
0.018 0.025
0.090 0.110
2.54 BSC
2.03 2.79
0.46 0.64
2.29 2.79
L
0.052 0.072
1.32 1.83
D 3 PL
H
M
N
0.280 0.320
0.197 REF
7.11 8.13
5.00 REF
0.13 (0.005)
M
T B
M
P
R
0.079 REF
0.039 REF
2.00 REF
0.99 REF
S
V
0.575 0.625
0.045 0.055
14.60 15.88
1.14 1.40
VARIABLE
CONFIGURATION
ZONE
R
N
U
P
STYLE 2:
PIN 1.
2.
3.
4.
GATE
DRAIN
SOURCE
DRAIN
M
F
VIEW W?W
1
L
M
F
VIEW W?W
2
L
M
F
VIEW W?W
3
L
SOLDERING FOOTPRINT*
8.38
0.33
10.66
0.42
17.02
0.67
1.016
0.04
3.05
0.12
SCALE 3:1
5.08
0.20
mm
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
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